Motherboard RepRap Arduino Mega Pololu Shields (RAMPS) 1.6

The RAMPS 1.6 board is a noteworthy upgrade in the series of RepRap Arduino Mega Pololu Shields (RAMPS) used primarily for 3D printing projects. It's designed as a modular, Arduino MEGA based solution for controlling RepRap machines.

Product Description

1. Enhanced Power Handling: One of the significant improvements in the RAMPS 1.6, as compared to its predecessors like RAMPS 1.4 and 1.5, is its enhanced power handling capabilities. This is achieved through a larger heatsink over the MOSFETs and a more substantial bed MOSFET, ensuring better heat dissipation and managing larger currents efficiently.

2. Improved Connectivity and Safety: The board replaces the original green power connector with a more robust pair of screw terminals, enhancing the connection's stability and safety. Additionally, it retains the surface-mounted fuses and flush MOSFETs seen in RAMPS 1.5, maintaining a balance between safety and functionality.

3. Support for Multiple Stepper Drivers: The RAMPS 1.6 board can support up to five Pololu stepper drive boards, such as A4988 or DRV8825. This feature makes it versatile for various 3D printing applications, allowing for fine control over multiple motors simultaneously.

4. Additional Features for Enhanced Functionality: The board comes with heater and fan MOSFET outputs and three thermistor interfaces. It also includes new 2-pin connectors, which are simpler to connect and less prone to burning out. The board layout supports additional security with 5A and component protection fuses, as well as an 11A fuse for the heated bed control, providing an extra layer of safety.

Specifications

• Size: Approximately 101.5 x 60.5mm.
• Microcontroller Compatibility: Works in conjunction with Arduino MEGA 2560.
• Input Voltage: Typically 12V.
• Maximum Power: Up to 270W.
• Layer Construction: 4-layer PCB for improved electrical stability.
• Connectivity: I2C and SPI pins available for future expansion; gold-plated connectors for limit stops, motors, and LEDs.
• Heatsink: Large heatsink over MOSFETs for better heat management.